Hokkaido University and Rensselaer Polytechnic Institute sign letter of intent for semiconductor collaboration

On August 20, 2024, Hokkaido University, Japan, and Rensselaer Polytechnic Institute (RPI), USA, signed a letter of intent to explore collaborative opportunities in human resource development and research activities in the semiconductor field. This letter of intent builds upon the strengths of both universities in this field.

(from left) Dr. Atsuyoshi Koike, CEO of Rapidus Corporation; Naomichi Suzuki, Governor of Hokkaido; Kiyohiro Houkin, President of Hokkaido University; Martin A. Schmidt, President of RPI; Rebecca Doerge, Provost of RPI; and Mukesh Khare, General Manager of IBM Semiconductors division and Vice President of Hybrid Cloud research, with the letter of intent. (Photo: Kris Qua/Rensselaer Polytechnic Institute)

Rensselaer Polytechnic Institute has a close relationship with major semiconductor organizations in the region, including the Albany NanoTech Complex and IBM in New York State, which has one of the world’s leading ecosystems for research and development in the semiconductor field, and is taking leading initiatives in education and research in the field.

Hokkaido University is strengthening its system as an education and research base in the semiconductor field. It has recently begun cooperating with semiconductor manufacturer Rapidus Corporation to enhance scientific and technological capabilities and develop human resources.

The press release from RPI is available here.